 They are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
Advantages
- High thermal conductivity
- Excellent hermeticity
- Excellent flatness, surface finish, and size control
- Semi-finished or finished (Ni/Au plated) products available
Technical Data
Type |
Composition |
Properties |
|
Tungsten Content (wt %) |
Density (g/cm3) |
CTE (ppm/K) |
Thermal Conductivity (W/m.K) |
W90Cu |
90 ± 1 |
17.0 |
6.5 |
180 - 190 |
W85Cu |
85 ± 1 |
16.3 |
7.0 |
190 - 200 |
W80Cu |
80 ± 1 |
15.6 |
8.3 |
200 - 210 |
W75Cu |
75 ± 1 |
14.9 |
9.0 |
220 - 230 |
|
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